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QianLi Kit Stensil BGA Reballing Baja Hitam untuk iPhone 6/6S/7/7P/8/8P/X/XS/11/12/13 Pro Max Chip IC CPU Mini Jaring Penanaman Timah

USD 3.50

QianLi Kit Stensil BGA Reballing Baja Hitam untuk iPhone 6/6S/7/7P/8/8P/X/XS/11/12/13 Pro Max Chip IC CPU Mini Jaring Penanaman Timah

Description

Black Steel BGA Reballing Stencil Kit for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11Pro/11Pro Max 12/13 PRO MAX MINI CPU IC Chip Tin Planting Soldering Net

Specification

Origin : Mainland China

Package : SMD

Dissipation Power : 3

Supply Voltage : 3

Application : Mobile Phone

Condition : New

Model Number : qianli

Type : Voltage Regulator

Operating Temperature : 3

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